New Research Defines a Method for Transfer Printing of Inorganic Thin-Films and MicroLED
The researchers leveraged LIE micro-holes and vacuum control modules to develop a novel selective transfer approach dubbed μVAST.
Researchers Make a Leap With 360 Degree AR Holographic Automotive Display
The researchers are now collaborating with Google to test the system in actual vehicles, with road trials potentially beginning in 2024.
AUO Closing Singapore LCD Plant, Moving Equipment to Taiwan
As LCD demand drops, AUO is refocusing on next-generation displays like MicroLEDs and expanding in the auto sector.
Is This the World’s Largest LED Canvas?
The structure features over 2,000 square meters of floor-to-ceiling LED screens with 8K resolution and 360-degree visuals.
LG’s Transparent Antenna and Automotive Glass
LG has invested heavily in a transparent antenna that it will showcase at CES 2024.
OLED Technology Development for Demand Growth
OLED technology is poised to resolve luminance and lifetime issues with development in materials and manufacturing processes. If technology development combined with capacity expansion can reduce cost, it can drive strong demand growth in future years.
Samsung Unveils New Sensors for Robots and VR/AR Devices
Both the 63D and 931 are currently sampling to device makers globally.
Leisurely Holiday Shopping Helped Big Ticket TV Sales
Television unit sales saw a 3% increase from the 2022 Black Friday Week
Alt-Reality Investments Skyrocket, But Future Success Remains Elusive
Contradictions abound in VR and AR, but sales do nothing but go down or disappoint.
Waiting Out OLED With MiniLED
Being a front-runner is exhausting. That’s how OLED may be feeling about right now.
2023 Market Update: TCL and Hisense Gain Ground as OLED and MiniLED Redefine Advanced TV Landscape
Western Europe and North America witnessed declines in shipments and revenues, whereas China and the Asia Pacific region saw increases.
Multi-Metal Layers Unlock a Brighter Future for High-Resolution MicroLED Displays
Researchers aimed to enhance the flip-chip bonding process using a layered gold-indium-gold metal sandwich.
