A New Glass Core Substrate From DNP
DNP’s (Dai Nippon Printing) new Glass Core Substrate (GCS) replaces conventional resin substrates, such as Flip Chip-Ball Grid Array (FC-BGA), with a glass substrate. It uses high-density Through Glass Via (TGV) technology, and the company claims that their GCS can offer better performance in semiconductor packages compared to existing solutions. Moreover, the new product can … Read more