LG Innotek Launches Thinnest Chip on Film (CoF) Targeted at XR Displays
The new design is a 2-metal COF with a PI thickness of 35 µm (half the thickness of human hair), Cu thickness of 8 µm, a fine pitch of 18 µm, and a line/space distance of 8/10 µm. The general thickness of semiconductor packaging materials is around 150 µmeters or more, LG’s 2-metal CoF is … Read more