Daily

The latest articles and news releases available for free

subscribe

A New Glass Core Substrate From DNP

by Omid Rahmat

DNP’s (Dai Nippon Printing) new Glass Core Substrate (GCS) replaces conventional resin substrates, such as Flip Chip-Ball Grid Array (FC-BGA), with a glass substrate. It uses high-density Through Glass Via (TGV) technology, and the …

Tags:DNP| Semiconductors

intoPIX Unveils Cutting-Edge Video Transport Solutions

by Emory Kale

intoPIX will be unveiling its cutting-edge wireless displays concept at GDC 2023, featuring the company’s unique TicoXS FIP compression. This TicoXS FIP technology wirelessly connects displays with sub-one-millisecond latency and pixel-perfect quality. Catherine Stroobants, …

Tags:intoPIX| Video Processors| Wireless