According to new reports, Microsoft’s next HoloLens device will be powered by Qualcomm’s new XR1 Platform chipset, which has been designed specifically for VR and AR applications. Details of the chip began to emerge late last month. Qualcomm is also believed to be collaborating on new devices with HTC, Meta and Vuzix.
Last week, sources revealed that the new HoloLens, codenamed “Sydney”, is scheduled for release during the first quarter of 2019.
