The MediaTek Dimensity 6100+ is a power-efficient SoC (system-on-chip), integrating an advanced 5G modem that aligns with the 3GPP Release 16 standard. It supports up to 140 MHz 2CC 5G Carrier Aggregation, delivering a substantial cut in power usage through MediaTek’s UltraSave 3.0+ technology. The SoC architecture includes two high-performance Arm Cortex-A76 cores alongside six power-efficient Arm Cortex-A55 cores. This configuration enhances several aspects such as AI-powered camera operations, display capabilities, user experience, GPU performance, and supports a range of peripheral features.
Elaborating on its features, the Dimensity 6100+ SoC offers support for cameras up to 108MP, with non-zero shutter lag, and allows for 2K video capture at 30 frames per second. It employs MediaTek’s UltraSave 3.0+ technology to achieve a remarkable 20% reduction in 5G power consumption compared to similar market solutions.
An AI-optimized camera setup is another highlight, equipped with bokeh effects for striking portrait and selfie images. MediaTek collaborates with Arcsoft to incorporate AI-color technology into mainstream devices, allowing users to express their creativity in novel ways. The SoC also supports a premium 10-bit display, along with supporting frame rates from 90Hz to 120Hz.
The new Dimensity 6000 series enhances MediaTek’s existing 5G portfolio, which already spans a broad price range. While the Dimensity 9000 series targets top-tier smartphones and tablets, the Dimensity 8000 family caters to premium mobile devices, and the Dimensity 7000 lineup adds depth to their high-tech offerings. The latest Dimensity 6000 series is set to bring high-end features into the mainstream 5G device market.
Expect to see the first wave of smartphones equipped with the Dimensity 6100+ chipset to hit the market in the third quarter of 2023.