What They Say
The Elec has more information on LGD’s OLEDonSilicon chip plans. The paper said that the devices will use a thin film encapsulant and colour filter, rather than glass. The colour filter will be just 1.5 microns thick and deposited using ALD first and then adding a silicon nitride layer, while the TFE layer will be 2.5 microns thick. The Elec contrasts this with Sony’s approach which uses dual glass substrates. It highlights that the LGD approach can use lower temperatures for the processing.
What We Think
The information was reported from an event in Korea. (BR)
