What They Say
JDI said that it has developed a new maskless deposition process for OLED materials based on photolithography. The firm said that the eLEAP technology can
- boost the aperture ratio of the area of the pixel by up to 60% and
- achieve double the emission efficiency of FMM (fine metal mask) patterning
- combined with oxide backplanes, the technique allows G8 fabrication (whereas FMM is limited to G6)
- The OLED has a 3X boost in lifetime at the same ppi
- The technique can double peak brightness and allow ‘free shapes’
- It can be used for every application that OLED currently addresses
The firm said that the process is greener than FMM as there is less material waste and less cleaning and CO2 emissions.
What We Think
I remember hearing the idea of using photolitho for OLEDs many years ago at an SID event, but, as I understand it, the key problem was developing OLED materials that could happily survive the photolithography process. Clearly, everyone that makes TFT displays should understand how to do it, and it solves the waste problem of evaporation methods. With the timing of this announcement, I thought there might be a SID paper, but I couldn’t see one.
The ability to scale to G8 is very useful, but I didn’t think that JDI had a fab beyond G6. Perhaps this development might provide an incentive to build one? (BR)
