Apple Planning Rear-Facing 3-D Sensors for AR

By Bob Raikes
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Apple is said to be working on a rear-facing 3D sensor system for next year’s iPhone according to Bloomberg. The news service said that the technology was intended to help with AR by better mapping the depth of objects in the environmant. Bloomberg said that Apple is working with Infineon on Time of Flight sensors that would be used.

Analyst Comment

As I’ve mentioned before, I was impressed with Intel’s RealSense technology, which also performs depth mapping and would be surprised if, eventually, it wasn’t on every camera. Knowing the depth of each pixel in an image makes post-processing much, much more powerful. However, it will not be trivial to get this technology to be both small enough and work over enough of a distance to be useful. (BR)