It has come to light that Microsoft filed a patent back in December 2016 for technology to widen the field of view (FOV) of its HoloLens augmented reality headset.
The documentation details a microelectromechanical laser scanner capable of generating light in two directions on a display and increasing the field of view from 35° to almost double that.
The next HoloLens device is currently scheduled for release during the first quarter of 2019. Reports suggest it will be powered by Qualcomm’s new Snapdragon XR1 Platform chipset.
