What They Say
MicroLED-Info posted a video showing a system for the mass transfer of microLED devices based on thermally induced adhesion modulation of shape memory polymers (SMP).
Heated micro patches on the transfer head use the SMP material on the head to adhere to the chip and then deposit it where needed.
What We Think
There seems to be plenty going on at Xerox. In 2019, the firm gave a paper at Display Week (25-4 / E. M. Chow – Xerographic MicroAssembly Printer for LEDs and Beyond) on device orientation and another in 2021 (59-6 / B. B. Rupp Directed Electrostatic Microassembly for MicroLED Display) that explained DARPA and US DOE assisted work on a ‘printer-like’ process for transfer. I guess, given the history of Xerox Parc with printing and electrostatics, we shouldn’t be surprised at this work! Then again, they are a long way from alone. (BR)
