Samsung has announced its latest application processor, the Exynos 9 Series 9810 and which is built on Samsung’s second-generation 10-nanometer (nm) FinFET process. The architecture is eight core and four of the cores can reach 2.9GHz, while the other four are optimised for efficiency. The chip has new features for improved AI performance and a new LTE modem. The AI feature will be used for 3D hybrid face detection and other deep learning applications.
The processor has had the video processing improved to support UltraHD both for capture and display and has been developed with 360º video in mind. It supports 10 bit HEVC and VP9 for HDR support and UltraHD can be processed at up to 120 fps.
Samsung said that the chip is the industry’s first Cat.18 LTE modem to support up to 6x carrier aggregation (CA) for 1.2Gbps downlink and 200 megabits per second (Mbps) uplink. The modem supports a 4×4 MIMO (Multiple-Input, Multiple-Output) and 256-QAM (Quadrature Amplitude Modulation) scheme, and uses enhanced Licensed-Assisted Access (eLAA) technology.
Mass production of the chip has already started.