The world’s first 10-core mobile chip, the Mediatek Helio X20 series, is due to become available this month – and China’s Meizu is the first to use the flagship Helio X25, in its dual-SIM Pro 6 smartphone.
Housed in an aluminium body, the processor is supported by 4GB of RAM and 32GB of storage on the base model. A 2,560mAh battery is used, with a rapid charging feature that will go from 0% to full charge in one hour. A USB-C port is featured.
‘3D Press’, a force-sensitive form of touch, is built in to the phone. Like Apple’s 3D Touch, this enables new ways to interact with menus and content, depending on the strength of a press. The Pro 6 also looks very iPhone-like in its design.
The 5.2″ 1920 x 1080 display is an AMOLED, and protected by 2.5D Gorilla Glass. Contrast ratio is 1,000:1 and brightness is 350 cd/m². Gorilla Glass 3 is also used to protect the 21.16MP camera, which uses a Sony IMX320 sensor. A laser autofocus and 10-LED ring flash (a first for smartphones) complete the rear camera specs. The front device uses a 5MP sensor.
Meizu has built in a feature called ‘mSound’: a combination of NXP’s smart amplifier system and the loudspeaker at the bottom of the phone. The speaker can be used for noise suppression while recording audio, by detecting the vibration on the diaphragm.
Global availability has not been mentioned, but Meizu has supplied Chinese prices. The phone can be pre-ordered now, starting at CNY2,500 ($385) for the 32GB model. A 64GB version will be available later, for CNY2,800 ($430).