What They Say
DSCC followed up the recent news by XDisplay about its tools being installed (XDC Installs World’s First 300mm MicroLED Tool) by interviewing the company.
The company said that it uses a stage with 600 x 800mm travel and can support support substrates up to 700mm. The system can transfer up to 240 million LEDs per hour (although in development, it ran at half this rate). The tool works with lateral “pads up” microLEDs and also flip-chip “pads down” microLEDs as well as microICs, lasers.
The tool has been installed in the US to support a pilot production line. In the current configuration, the wafers are designed to be ‘transfer ready’ with integrated tethers that break when the stamp picks up the LED.
The company said it has achieved 99.999% transfer yield and is confident that it can get to 99.9999% in mass production. It also said that ten companies have licensed the technology so far.
There are more details on the devices, including an RGB package approach in the DSCC blog.
What We Think
By my calculation, the six nines level that XDisplay is claiming would mean RGB pixels or 24 subpixels on an UltraHD display, which is a realistic level to rework, although not ideal. The likely first application for this kind of system is small displays though, I think. Smartwatches are widely regarded as a good potential first application for volume. (BR)
Microscope Image of a PixelEngine Component that Includes Redundant 8 × 15 µm2 Flip-Chip MicroLEDs Integrated with the Underlying MicroIC Driver. Image:XDC – click for higher resolution
