The CH II is a new display from Dahua incorporating the company’s flip chip on board (COB) technology for LED displays. The company claims its surface luminescence provides softer, pixel-free illumination, which counters digital visual fatigue, and ensures uniform color from all viewing angles by perfecting ink color parameters, addressing and eliminating the industry challenge of batch ink color discrepancies.
The display is dustproof and fingerprint-proof, waterproof, moisture-resistant with PPM<20, and can withstand slight bumps without damage. It has a claimed contrast ratio of 10,000:1 and provides a 160° horizontal and 160° vertical ultra-wide viewing angle.
Feature | Flip COB | SMD |
---|---|---|
Mounting Technique | Directly bonded to the PCB or substrate without traditional wire bonding. | Individual LED packages soldered directly onto the PCB. |
Size and Pixel Density | Allows for a more compact design and higher pixel density due to the lack of individual packaging around diodes. | The presence of individual packages might limit the closeness of LED arrangement, potentially resulting in a lower pixel density. |
Protection & Durability | Better protection due to encapsulation of the LED chip. | Might be more susceptible to physical damage because individual LEDs are exposed. |
LED Configuration | Single LED chip can serve the display purpose. | Typically contains multiple diodes (e.g., red, green, blue) in a single package for full-color displays. |
Heat Dissipation | Often offers better heat dissipation due to direct bonding with the substrate. | Might be less efficient in heat dissipation compared to COB. |
Repair & Maintenance | Can be more challenging because individual LEDs aren’t easily replaceable. | Easier to replace individual malfunctioning LEDs. |
Dahua is emphasizing the energy efficiency, with each cabinet consuming less than 75W, claiming a 40% reduction in energy use compared to surface mount display (SMD) products. For the target audience of systems integrations, the CH II is supposed to provide simplified and quick maintenance with full front access.
Specification | Details |
---|---|
Pixel Pitch | 0.9375mm |
Pixel Configuration | 1R1G1B |
LED Type | Flip COB Chip |
Brightness (Max) | 800 nit |
Color Temperature | 9300K ± 200K |
Viewing Angle | H160° / V160° |
Pixel Density | 1,137,778 dots/m² |
Module Size | 150mm×168.75mm |
Module Resolution | 160×180 dots |
Cabinet Size | W600mm×H337.5mm×D40mm |
Cabinet Resolution (W×H) | 640×360 dots |
Cabinet Weight | 4.0 kg ± 0.1 |
Cabinet Material | Die-casting Aluminum |
Operating Temperature/Humidity | -10℃~+40℃/10~80%RH |
Storage Temperature/Humidity | -20℃~+60℃/10~80%RH |
IP Rating | Front IP65/Rear IP43 |
Aspect Ratio | 16:9 |
Gray Scale | 13 bit |
Contrast Ratio | 10000:1 |
Refresh Rate | 3840Hz |
Input Voltage | AC 110~220V (+/-10%) |
Input Power (max) | 370 W/m2 |
Input Power (Avg) | 125 W/m2 |
Installation | Wall Mounted/Floor Mounted |
Maintenance | Front Maintenance |
Lamp Lifespan | ≥100,000 H |
Signal Transmission Distance | CAT5 Cable ( L≤100m ), multi-mode fiber ( L≤300m ), single mode fiber (L≤10km) |