Ares Materials, a display materials design company, has launched Easybond, a new Mechanical Lift-Off (MLO) technology designed to temporarily bond solution-cast flexible substrates to the display mother glass during the flexible OLED display fabrication process.
The company claims that Easybond makes it easier than ever to delaminate plastic-based modules from the carrier surface after high-temperature processing (up to 500°C) without the need for Laser Lift-Off (LLO) processing. Applications range from LTPS backplanes and touch panels, to flexible colour filters.
By applying Easybond directly on the mother glass before coating the base plastic layer, the OLED module can later be released with a low peel force that reportedly doesn’t damage the structures on top. The company estimates that effects resulting from the current laser LLO process decrease OLED manufacturing yield to as low as 70%.
Easybond’s MLO technology is designed to enable panel makers to avoid this. Another purported advantage of Easybond is a low associated capital expense. The company says that manufacturers will not require new equipment and will no longer need laser lift-off machines.
Ares Materials will be demonstrating the new technology at Display Week 2018 this May.
