amsung Electronics is stepping up its investment in semiconductor packaging to meet the increasing demand for high-bandwidth memory (HBM) chips, an essential component in artificial intelligence and high-performance computing. In a recent announcement, Samsung revealed plans to expand its semiconductor packaging facility in Cheonan, South Chungcheong Province, with completion slated for December 2027. This expansion reflects the company’s commitment to advancing in the competitive HBM market.
Under a newly signed memorandum of understanding with the South Chungcheong provincial government, Samsung will taking over a building owned by its subsidiary, Samsung Display, where it produced LCD panels.
Despite its dominance in the memory chip industry, Samsung faces fierce competition in the HBM market, particularly from rivals who have gained approvals from major AI chip clients such as Nvidia. While Samsung’s latest HBM3E chips have not yet received Nvidia’s certification, the expanded facility signals Samsung’s intention to secure a foothold in the rapidly evolving semiconductor landscape.
