Toshiba Corporation’s Semiconductor & Storage Products Company today announced that it will showcase its leading-edge semiconductor and storage technologies and solutions at electronica China 2016. Toshiba will highlight solutions in three areas—Automotive, IoT and Industrial—under the unifying concept of creating a safe, secure and comfortable society.
The trade fair for electronic components, systems and applications will be held at Shanghai New International Expo Centre(SNIEC) from March 15 to 17.
Outline of the Toshiba booth at electronica China 2016
1. Date: March 15 to 17, 2016
2. Venue : Shanghai New International Expo Centre(SNIEC)
3. Booth No: Hall E2. 2400
4. Main Exhibitions:
(1) Automotive:
Exhibits will spotlight Toshiba’s line-up of automotive semiconductors for use in Advanced Driver Assistance System (ADAS) solutions that support a safer driving experience. Leading-edge image processing technologies, including image recognition processors that can execute multiple functions simultaneously, and display controllers that can control head-up displays (HUD) and instrument clusters simultaneously, will be on display. Motor control technologies that support a safer driving experience will also be displayed.
(2) IoT:
Leading-edge products and solutions will underline Toshiba’s contributions to IoT, including memory and storage products that meet fast increasing demand for data explosion. Products on show will include “BiCS FLASH™”, the world’s first[1] 48-layer three dimensional stacked cell structure flash memory, and “BG1 Series” SSDs, the world’s smallest[2]. Other IoT solutions on display include “TransferJet™” close proximity wireless communication technology products; “FlashAir™” SDHC memory cards with wireless LAN; and “ApP Lite™” application processors.
(3) Industrial:
The latest line-up of Toshiba’s discrete power products and analog ICs offer features that contribute to an eco-friendly society. High efficiency, high performance discretes will include high power IGBT modules for railroads, power transmission & distribution and inverter systems; next-generation power products using SiC; and low power loss MOSFETs that lower power consumption in electronic devices. Motor control solutions that cut power consumption and also reduce end-product development time will also be featured.
