SiliconCore was at NAB showing off its range of LED screens. New is their LISA screen which features Chip on Board (COB) LED integration technology. (shown at ISE – Silicon Core Adopts COB Technology) With this approach, the LED die is bonded directly to the PCB substrate of the display.
As noted in the graphic below. LED that are packaged a surface mount devices include an encapsulation around the LED and bonding wires. With COB, there is no encapsulation and the die needs to be wire bonded on the PCB.
SiliconCore’s LISA uses COB technology
Covering the PCB is a specially designed molding that provides a smooth surface on one side and a cavity around each LED. This helps collect and disperse the light. This smooth surface also allows the use of a touch screen overlay.
The big advantage of COB is the ability to reduce the footprint of each LED allowing for smaller pitches, or fill factor and better economies of scale, says SiliconCore. In reality, we were a bit disappointed with the image quality as it looks more pixelated than other demos I have seen at the same 1.9 mm pitch.
LISA panels at 1.9mm are scheduled for production in June 2017 with 1.2mm to follow later. The architecture should allow sub-mm pitches later on as well.
SiliconCore also showed us a behind the scenes demo of a low lumen module with a black level in the 0.5 cd/m² range. – CC
