There’s some interesting news about how Blue Cheetah Analog Design and LG Electronics are working together on developing a new generation of chiplets, which are smaller, modular pieces of integrated circuits (ICs) that can be combined into more complex systems. LG has successfully taped out silicon using Blue Cheetah’s chiplet interconnect technology, which enables seamless communication between different components in a System-in-Package (SiP). These components include processors, memory interfaces, and AI accelerators. The use of Blue Cheetah’s die-to-die (D2D) interconnect IP allows LG to combine chiplets manufactured at various process nodes (16nm, 12nm, 7nm, etc.) across different foundries, making scaling more cost-effective and reusing IP easier across multiple product lines.
Theoretically, with AI accelerators integrated into the chiplets, LG TVs and monitors could offer more advanced AI-driven features, such as improved image processing, enhanced upscaling, personalized content recommendations, and better voice control capabilities. By combining chiplets from different process technologies, LG can optimize the cost of producing high-performance components.
LG should be looking for more processing power (such as faster image rendering, smoother graphics) and energy efficiency, and the use of flexible chiplet designs and interconnect standards like UCIe (Universal Chiplet Interconnect Express) and BoW (Bunch of Wires) allows LG to adapt to new technologies more quickly.
