The gist of it: back in 2017, it was said on these pages, “… TFE (thin film encapsulation) will dominate the market with 70% of the market for OLEDs using that method by 2021.” Give it time, it is happening. Maybe 3-5 years from now.
The Elec is reporting that LG Display is developing a new etching technology for OLED panels that will be supplied to Apple, to be used in a hybrid OLED panel. The hybrid OLED panel uses a glass substrate like a rigid OLED panel, but instead of using two glass substrates, the top one is replaced with thin-film encapsulation (TFE). This results in a thinner panel, with the remaining bottom glass substrate etched even thinner from 0.5mm to 0.2mm. TFE is commonly used in the production of flexible OLED panels. Flexible OLED panels require a TFE layer that is both thin and flexible to allow the panel to bend and flex without cracking or breaking. TFE is also used in some other types of electronic displays, such as flexible e-paper displays.
The challenge is that the ultra-thin glass substrate is vulnerable to breaking while being moved to the next process in the production line. To address this, LG Display is developing an etching technology that simultaneously etches and cuts the glass substrate into cell units, which eliminates the need for moving the glass and reduces the risk of breaking. LG Display plans to apply the new technology to its first Gen 8 OLED line. As for its OLED panels for Apple’s iPads launching next year, they will be made using the prior process at the company’s current Gen 6 OLED line, with the etching process handled by Avatec. Samsung Display has also been developing a similar etching technology and will begin applying it immediately for the iPad OLED panels it will manufacture in its Gen 6 OLED line, with the etching process handled by Chemtronics.
