FlexTech Completes US Army R&D

FlexTech has completed three flexible hybrid electronics R&D projects, under its US Army Research Laboratory technology investment agreement. They include a project with ENrG (Buffalo, New York) to develop a flexible ceramic substrate (20µm thick); a 3D printer for the rapid prototyping of new electronic devices, with nScrypt (Orland, Florida) and a flexible sensor platform with PARC (Palo Alto, California).