E Ink has partnered with Realtek to launch a second-generation System-on-Panel (SoP) electronic shelf label (ESL) reference design that promises slimmer borders and improved efficiency.
The new solution integrates Realtek’s Bluetooth chipset directly onto the glass substrate of E Ink’s displays, using Chip-on-Glass (CoG) technology. This cuts product size by about 30% and the flexible printed circuit (FPC) by roughly half, compared to similar devices with the same display area, according to E-Ink.
The second-generation SoP design features an optimized circuit layout and transmission line architecture. Its FPC is integrated onto the back of the panel for a more compact label form and reduced environmental impact. E Ink estimates that over the past seven years, about 600 million 3-inch ePaper labels have been deployed worldwide, emitting far less carbon dioxide compared with paper labels.
The two companies said the new design is ready for commercial production. E Ink has set a goal of net-zero carbon emissions by 2040.
